AGFB004R16A2E3E
392000-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB004R16A2E3E is a high-density FPGA SoC from the AGFB004 series, featuring 392,000 logic cells and 384 configurable I/O pins. This component utilizes advanced FINFET technology for enhanced performance and power efficiency, operating within a 0.664V to 0.706V supply voltage range. Its R-PBGA-B1681 package, a 1681-ball grid array with a 0.920mm terminal pitch, ensures robust connectivity and thermal management. Operating from 0°C to 100°C, this surface-mount device is suitable for demanding applications in telecommunications, data center acceleration, and high-performance computing. The rectangular plastic/epoxy package has a maximum seated height of 3.6760mm.
Additional Information
Series: AGFB004RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 37.5000 |
| Width | 34.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 392000 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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