AGFB004R16A1E3E
392000-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB004R16A1E3E is a high-density FPGA SOC from the AGFB004 series. This component features 392,000 logic cells and supports 384 inputs and 384 outputs, all within a 1681-terminal PBGA package. Constructed using FINFET technology, it operates within a temperature range of 0.0°C to 100.0°C. The device utilizes a Ball Grid Array (BGA) package with a terminal pitch of 0.920mm, and a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. Its rectangular package shape and bottom-mounted terminals facilitate surface mounting. This FPGA is suitable for demanding applications in high-performance computing, networking infrastructure, and advanced data processing.
Additional Information
Series: AGFB004RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 37.5000 |
| Width | 34.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 392000 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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