AGFA027R33A1I3E
Field Programmable Gate Array, 2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFA027R33A1I3E is a high-density Field Programmable Gate Array from the AGFA027 series, featuring 2,692,760 logic cells. This device utilizes FINFET technology and is housed in a 3343-terminal R-PBGA package with a rectangular body shape and bottom-mounted ball terminals. It offers 768 inputs and 768 outputs, with an organization of 91,280 CLBs. The operating temperature range is from -40°C to 100°C, with a nominal supply voltage of 0.685V, ranging from 0.664V to 0.706V. This component is designed for surface mounting and is suitable for demanding applications in sectors such as telecommunications, data center infrastructure, and high-performance computing.
Additional Information
Series: AGFA027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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