AGFA027R24C3E4XC
Field Programmable Gate Array, 2692760-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFA027R24C3E4XC is a high-density Field Programmable Gate Array (FPGA) from the AGFA027 series. This device features 2,692,760 logic cells and an organization of 91,280 CLBs, offering substantial capacity for complex digital designs. It provides 744 input and 744 output terminals, all presented in a 2340-terminal R-PBGA (Ball Grid Array) package with a terminal pitch of 0.920mm. Designed for surface mounting, the component operates within a temperature range of 0°C to 100°C. Its plastic/epoxy package is rectangular with a grid array style. This FPGA is suitable for demanding applications across various industries, including telecommunications, data processing, and industrial automation.
Additional Information
Series: AGFA027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 45.0000 |
| Width | 42.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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