AGFA027R24C3E3EC
Field Programmable Gate Array, 2692760-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFA027R24C3E3EC is a high-density Field Programmable Gate Array (FPGA) from the AGFA027 series. This component features 2,692,760 logic cells and 91,280 CLBs, providing substantial programmable logic capacity. It offers 744 input and 744 output connections, supported by a total of 2340 terminals arranged in a PBGA2340 package. The device operates within a temperature range of 0°C to 100°C and is designed for surface mounting. Its rectangular grid array package has a terminal pitch of 0.920mm. This FPGA is suitable for demanding applications in telecommunications, data processing, and high-performance computing.
Additional Information
Series: AGFA027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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