AGFA019R24C2E2V
Field Programmable Gate Array, 1.918975e+06-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFA019R24C2E2V is a high-density Field Programmable Gate Array (FPGA) from the AGFA019 series. This device offers 1,918,975 logic cells and 65,050 CLBs, providing extensive capacity for complex digital designs. It features 480 input and 480 output connections, supported by a total of 2340 terminals in a rectangular R-PBGA-B2340 package. The component operates within a temperature range of 0°C to 100°C. Its grid array package style with ball terminals and a pitch of 0.920mm facilitates dense board layouts. This FPGA is suitable for demanding applications in industries such as telecommunications, data processing, and industrial automation.
Additional Information
Series: AGFA019RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 45.0000 |
| Width | 42.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 65050 |
| Number_of_Inputs | 480 |
| Number_of_Logic_Cells | 1918975 |
| Number_of_Outputs | 480 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 65050 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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