AGFA012R24C2E3EC
Field Programmable Gate Array, 1178525-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFA012R24C2E3EC is a high-density Field Programmable Gate Array (FPGA) from the AGFA012 series. This component features 1,178,525 logic cells organized into 39,950 CLBs, providing extensive capacity for complex digital designs. It offers 744 bidirectional I/O pins, enabling robust interfacing capabilities. The device is housed in a 2340-ball Plastic Ball Grid Array (PBGA) package with a 0.920 mm terminal pitch, conforming to the R-PBGA-B2340 standard. Designed for surface mounting, it operates within a temperature range of 0°C to 100°C. Applications for this FPGA include demanding sectors such as telecommunications, data processing, and advanced industrial control systems.
Additional Information
Series: AGFA012RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 45.0000 |
| Width | 42.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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