1SX210HN3F50E3XP
Field Programmable Gate Array, 2100000-Cell, PBGA2397Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 1SX210HN3F50E3XP is a high-performance Field Programmable Gate Array from the 1SX210 series. This device features 2,100,000 logic cells and 262,500 CLBs, supported by 704 input and 704 output connections. It is housed in a 2397-ball PBGA package (JESD-30 Code S-PBGA-B2397) with a terminal pitch of 1.000 mm. The component operates within a temperature range of 0.0°C to 100.0°C and utilizes a nominal supply voltage of 0.85V, with a range of 0.820V to 0.880V. The package dimensions are 50.0000mm x 50.0000mm with a maximum seated height of 3.8810mm. This FPGA is commonly deployed in demanding applications across industrial, communications, and data center markets due to its extensive logic capacity and efficient power characteristics.
Additional Information
Series: 1SX210RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 50.0000 |
| Width | 50.0000 |
| JESD_30_Code | S-PBGA-B2397 |
| Number_of_CLBs | 262500 |
| Number_of_Inputs | 704 |
| Number_of_Logic_Cells | 2100000 |
| Number_of_Outputs | 704 |
| Number_of_Terminals | 2397 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 262500 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2397,49X49,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Supply_Voltage_Max | 0.88000 |
| Supply_Voltage_Min | 0.82000 |
| Supply_Voltage_Nom | 0.85 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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