1ST250EY3F55E1VG
Field Programmable Gate Array, 2500000-Cell, PBGA2912Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 1ST250 Field Programmable Gate Array (FPGA), part number 1ST250EY3F55E1VG, features 2,500,000 logic cells organized into 312,500 CLBs. This device utilizes an S-PBGA-B2912 package, a square plastic/epoxy grid array with 2912 bottom-mounted solder ball terminals on a 1.000mm pitch. The FPGA operates within a temperature range of 0°C to 100°C and is suitable for surface-mount applications. Its substantial logic capacity and array architecture make it well-suited for demanding applications in telecommunications, data processing, and industrial automation.
Additional Information
Series: 1ST250RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 55.0000 |
| Width | 55.0000 |
| JESD_30_Code | S-PBGA-B2912 |
| Number_of_CLBs | 312500 |
| Number_of_Inputs | 296 |
| Number_of_Logic_Cells | 2500000 |
| Number_of_Outputs | 296 |
| Number_of_Terminals | 2912 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 312500 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2912,54X54,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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