1ST250EU2F50E3VG
Field Programmable Gate Array, 2500000-Cell, PBGA2397Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel 1ST250EU2F50E3VG is a high-density Field Programmable Gate Array (FPGA) from the 1ST250 series. This component offers 2,500,000 logic cells, organized into 312,500 CLBs, and features 440 input and 440 output connections. It is housed in a 2397-ball Plastic Ball Grid Array (PBGA) package, with a terminal pitch of 1.000 mm and a seated height of up to 3.8810 mm. The device operates within a temperature range of 0.0°C to 100.0°C. Applications for this FPGA span industries such as telecommunications, aerospace and defense, and industrial automation, where its configurability and performance are critical.
Additional Information
Series: 1ST250RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 50.0000 |
| Width | 50.0000 |
| JESD_30_Code | S-PBGA-B2397 |
| Number_of_CLBs | 312500 |
| Number_of_Inputs | 440 |
| Number_of_Logic_Cells | 2500000 |
| Number_of_Outputs | 440 |
| Number_of_Terminals | 2397 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 312500 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2397,49X49,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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