1ST250EH3F50I3VG
Field Programmable Gate Array, 2500000-Cell, PBGA2397Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 1ST250EH3F50I3VG is a Field Programmable Gate Array (FPGA) from the 1ST250 series. This component features 2,500,000 logic cells and is housed in a 2397-ball PBGA package (S-PBGA-B2397) with a 1.000 mm terminal pitch. Its organization comprises 312,500 CLBs, with 440 dedicated input and output terminals. Designed for surface mounting, this FPGA operates within a temperature range of -40°C to 100°C. Applications for this device are found in high-performance computing, telecommunications infrastructure, and advanced industrial automation systems.
Additional Information
Series: 1ST250RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 50.0000 |
| Width | 50.0000 |
| JESD_30_Code | S-PBGA-B2397 |
| Number_of_CLBs | 312500 |
| Number_of_Inputs | 440 |
| Number_of_Logic_Cells | 2500000 |
| Number_of_Outputs | 440 |
| Number_of_Terminals | 2397 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 312500 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2397,49X49,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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