1ST165ES3F50E3VG
Field Programmable Gate Array, 1650000-Cell, PBGA2397Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 1ST165ES3F50E3VG is a Field Programmable Gate Array (FPGA) from the 1ST165 series. This device features 1,650,000 logic cells and 206,250 CLBs, offering substantial logic density for complex designs. It is housed in a 2397-ball Grid Array (PBGA2397) package with a 1.000 mm terminal pitch and a square footprint measuring 50.00 mm by 50.00 mm. The component is designed for surface mounting and operates within a temperature range of 0°C to 100°C. Its robust architecture supports demanding applications in telecommunications, data processing, and industrial automation. The device includes 440 input and 440 output terminals.
Additional Information
Series: 1ST165RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 50.0000 |
| Width | 50.0000 |
| JESD_30_Code | S-PBGA-B2397 |
| Number_of_CLBs | 206250 |
| Number_of_Inputs | 440 |
| Number_of_Logic_Cells | 1650000 |
| Number_of_Outputs | 440 |
| Number_of_Terminals | 2397 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 206250 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2397,49X49,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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