1ST165EN2F50E3VG
Field Programmable Gate Array, 1650000-Cell, PBGA2397Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 1ST165EN2F50E3VG is a Field Programmable Gate Array (FPGA) from the 1ST165 series. This component features 1,650,000 logic cells, organized into 206,250 CLBs, and offers 440 input and 440 output terminals. It is housed in a 2397-ball Grid Array (PBGA2397) package, measuring 50x50mm with a 1.000mm terminal pitch and a seated height of 3.8810mm. The device operates within a temperature range of 0°C to 100°C and is suitable for surface mounting. This FPGA is utilized in applications across telecommunications, industrial automation, and high-performance computing.
Additional Information
Series: 1ST165RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 50.0000 |
| Width | 50.0000 |
| JESD_30_Code | S-PBGA-B2397 |
| Number_of_CLBs | 206250 |
| Number_of_Inputs | 440 |
| Number_of_Logic_Cells | 1650000 |
| Number_of_Outputs | 440 |
| Number_of_Terminals | 2397 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 206250 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2397,49X49,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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