1ST085EH3F50I2VG
Field Programmable Gate Array, 850000-Cell, PBGA2397Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel's 1ST085EH3F50I2VG is a high-density Field Programmable Gate Array (FPGA) from the 1ST085 series. This component features 850,000 logic cells and 106,250 CLBs, providing extensive logic capacity for complex digital designs. It is housed in a 2397-ball Plastic Ball Grid Array (PBGA) package with a 1.000mm terminal pitch, designed for surface mounting. The operating temperature range is -40°C to 100°C, suitable for demanding environments. This FPGA is utilized across various industries, including telecommunications, industrial automation, and high-performance computing, where its reconfigurability and processing power are critical. The JEDEC standard S-PBGA-B2397 package ensures compatibility with industry-standard assembly processes.
Additional Information
Series: 1ST085RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 50.0000 |
| Width | 50.0000 |
| JESD_30_Code | S-PBGA-B2397 |
| Number_of_CLBs | 106250 |
| Number_of_Inputs | 440 |
| Number_of_Logic_Cells | 850000 |
| Number_of_Outputs | 440 |
| Number_of_Terminals | 2397 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 106250 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2397,49X49,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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