1SM16CHU3F53E3VG
Field Programmable Gate Array, 1.65e+06-Cell, PBGA2597Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 1SM16CHU3F53E3VG is a high-density Field Programmable Gate Array from the 1SM16 series. This component features 1.65 million logic cells, organized into 206,250 CLBs, providing extensive logic implementation capabilities. It is housed in a 2597-terminal PBGA package with a 1.000mm terminal pitch, measuring 52.5mm x 52.5mm. Operating within a temperature range of 0°C to 100°C, this device is suitable for demanding applications in industrial, communications infrastructure, and data center markets. The BGA package style ensures robust solder joint reliability for surface-mount assembly.
Additional Information
Series: 1SM16RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 52.5000 |
| Width | 52.5000 |
| JESD_30_Code | S-PBGA-B2597 |
| Number_of_CLBs | 206250 |
| Number_of_Inputs | 656 |
| Number_of_Logic_Cells | 1650000 |
| Number_of_Outputs | 656 |
| Number_of_Terminals | 2597 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 206250 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2597,51X51,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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