1SG250LU3F50E3YG
Field Programmable Gate Array, 2422000-Cell, PBGA2397Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 1SG250LU3F50E3YG is a Field Programmable Gate Array (FPGA) from the 1SG250 series, featuring 2,422,000 logic cells and a 2397-ball PBGA package (JESD-30 Code: S-PBGA-B2397). This device utilizes FINFET technology and is designed for surface-mount applications with a 1.000 mm terminal pitch. The component operates within a temperature range of 0.0°C to 100.0°C and offers 736 inputs and 736 outputs. Its square, grid array package has dimensions of 50.0000 mm x 50.0000 mm with a maximum seated height of 3.8810 mm. Applications for this high-density FPGA are prevalent in telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: 1SG250RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 50.0000 |
| Technology | FinFET |
| Length | 50.0000 |
| JESD_30_Code | S-PBGA-B2397 |
| Number_of_Inputs | 736 |
| Number_of_Logic_Cells | 2422000 |
| Number_of_Outputs | 736 |
| Number_of_Terminals | 2397 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA2397,49X49,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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