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Field Programmable Gate Arrays

1SG250HU3F50E3XP

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1SG250HU3F50E3XP

Field Programmable Gate Array, 2422000-Cell, PBGA2397

Manufacturer: Intel

Categories: Field Programmable Gate Arrays

Quality Control: Learn More

Intel 1SG250HU3F50E3XP, a Field Programmable Gate Array from the 1SG250 series, features a substantial logic capacity of 2,422,000 logic cells organized into 302,750 CLBs. This device is housed in a 2397-ball Grid Array (PBGA2397) package with a 1.000 mm terminal pitch, measuring 50x50 mm. It operates within a temperature range of 0°C to 100°C and requires a supply voltage of 0.85V nominal, with a minimum of 0.82V and a maximum of 0.88V. The component is designed for surface mounting with ball terminals. Applications for this high-performance FPGA include telecommunications infrastructure, data center acceleration, and advanced computing systems.

Additional Information

Series: 1SG250RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:
Technical Details:
Width50.0000
Length50.0000
JESD_30_CodeS-PBGA-B2397
Number_of_CLBs302750
Number_of_Inputs736
Number_of_Logic_Cells2422000
Number_of_Outputs736
Number_of_Terminals2397
Operating_Temperature_Max100.0
Operating_Temperature_Min0.0
Organization302750 CLBS
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeBGA
Package_Equivalence_CodeBGA2397,49X49,40
Package_ShapeSquare
Package_StyleGRID ARRAY
Programmable_Logic_TypeFIELD PROGRAMMABLE GATE ARRAY
Seated_Height_Max3.8810
Supply_Voltage_Max0.88000
Supply_Voltage_Min0.82000
Supply_Voltage_Nom0.85
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.000
Terminal_PositionBottom

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