1SG211HN3F43E3XP
Field Programmable Gate Array, 2073000-Cell, PBGA1760Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel 1SG211HN3F43E3XP, a member of the 1SG211 series, is a high-density Field Programmable Gate Array (FPGA) with 2,073,000 logic cells. This component features a 1760-ball PBGA package (JESD_30 Code: S-PBGA-B1760) with a 1.000 mm terminal pitch, designed for surface mounting. It offers 704 input and 704 output terminals, organized into 259,125 CLBs. The operating temperature range is from 0.0°C to 100.0°C, with a nominal supply voltage of 0.85V, ranging from 0.820V to 0.880V. The plastic/epoxy package has dimensions of 42.5000 mm by 42.5000 mm. This FPGA is suitable for demanding applications in sectors such as telecommunications, data center infrastructure, and high-performance computing.
Additional Information
Series: 1SG211RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 42.5000 |
| Width | 42.5000 |
| JESD_30_Code | S-PBGA-B1760 |
| Number_of_CLBs | 259125 |
| Number_of_Inputs | 704 |
| Number_of_Logic_Cells | 2073000 |
| Number_of_Outputs | 704 |
| Number_of_Terminals | 1760 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 259125 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA1760,42X42,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.8810 |
| Supply_Voltage_Max | 0.88000 |
| Supply_Voltage_Min | 0.82000 |
| Supply_Voltage_Nom | 0.85 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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