10AX032E4F27I3SP
Field Programmable Gate Array, 320000-Cell, PBGA672Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel's 10AX032E4F27I3SP is a high-density Field Programmable Gate Array (FPGA) from the 10AX032 series. This component offers 320,000 logic cells and an organization of 11,990 Configurable Logic Blocks (CLBs), providing substantial capacity for complex digital designs. It features 240 input and 240 output terminals, with a total of 672 terminals within its 27x27mm square PBGA672 package. The device operates within a temperature range of -40°C to 100°C and requires a nominal supply voltage of 0.9V, with a range of 0.87V to 0.93V. Manufactured using TSMC technology, this surface-mount device utilizes ball terminals with a 1.00mm pitch. The 10AX032E4F27I3SP is well-suited for demanding applications in the industrial, communications, and computing sectors.
Additional Information
Series: 10AX032RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 27.0000 |
| Technology | TSMC |
| Length | 27.0000 |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_CLBs | 11990 |
| Number_of_Inputs | 240 |
| Number_of_Logic_Cells | 320000 |
| Number_of_Outputs | 240 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 11990 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA672,26X26,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.3500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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