10AX032C1F27I3SP
Field Programmable Gate Array, 320000-Cell, PBGA672Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 10AX032C1F27I3SP is a high-performance Field Programmable Gate Array (FPGA) from the 10AX032 series. This device offers 320,000 logic cells and is housed in a 672-ball Grid Array (BGA) package, specifically a PBGA672 (JESD_30_Code: S-PBGA-B672) with a terminal pitch of 1.00 mm. It operates within an industrial temperature range of -40°C to 100°C and features a nominal supply voltage of 0.9V. The organization includes 11990 Configurable Logic Blocks (CLBs), with 240 input and 240 output terminals available. This FPGA is designed for demanding applications across various industries, including telecommunications, data center acceleration, and industrial automation. Its robust construction and advanced architecture make it suitable for complex digital designs requiring significant logic density and high-speed signal processing. The component is surface-mount and utilizes TSMC technology.
Additional Information
Series: 10AX032RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 27.0000 |
| Width | 27.0000 |
| Technology | TSMC |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_CLBs | 11990 |
| Number_of_Inputs | 240 |
| Number_of_Logic_Cells | 320000 |
| Number_of_Outputs | 240 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 11990 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA672,26X26,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.3500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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