10AX022R2F27E3LP
Field Programmable Gate Array, 220000-Cell, PBGA672Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel's 10AX022R2F27E3LP is a high-performance Field Programmable Gate Array (FPGA) from the 10AX022 series. This device offers 220,000 logic cells and an organization of 8033 CLBs (Configurable Logic Blocks), providing substantial logic density for complex digital designs. It features 240 input and 240 output lines, enabling versatile interfacing. The component is housed in a 672-terminal PBGA (Plastic Ball Grid Array) package with a 1.00 mm terminal pitch, specified by JEDEC code S-PBGA-B672. Operating within a temperature range of 0°C to 100°C, it utilizes a nominal supply voltage of 0.9 V (ranging from 0.87 V to 0.93 V). This FPGA finds application in demanding sectors such as communications, computing, and industrial automation. The package dimensions are 27.00 mm x 27.00 mm with a maximum seated height of 3.35 mm, constructed from plastic/epoxy material.
Additional Information
Series: 10AX022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 27.0000 |
| Width | 27.0000 |
| Technology | TSMC |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_CLBs | 8033 |
| Number_of_Inputs | 240 |
| Number_of_Logic_Cells | 220000 |
| Number_of_Outputs | 240 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 8033 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA672,26X26,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.3500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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