10AX022H2U19E3SP
Field Programmable Gate Array, 220000-Cell, PBGA484Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel's 10AX022H2U19E3SP is a high-density Field Programmable Gate Array (FPGA) from the 10AX022 series, featuring 220,000 logic cells and an organization of 8033 CLBs. This device is housed in a 484-ball PBGA (Plastic Ball Grid Array) package, specified by the S-PBGA-B484 code, with a 0.800mm terminal pitch. It operates within a temperature range of 0.0°C to 100.0°C and utilizes a nominal supply voltage of 0.9V, with a minimum of 0.870V and a maximum of 0.930V. The FPGA is designed for surface mounting and employs a plastic/epoxy package body material. Its architecture supports 240 inputs and 240 outputs. This component finds application in demanding sectors such as telecommunications, data center infrastructure, and high-performance computing, where its configurable logic and extensive cell count enable complex digital signal processing and system-level integration.
Additional Information
Series: 10AX022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 19.0000 |
| Technology | TSMC |
| Length | 19.0000 |
| JESD_30_Code | S-PBGA-B484 |
| Number_of_CLBs | 8033 |
| Number_of_Inputs | 240 |
| Number_of_Logic_Cells | 220000 |
| Number_of_Outputs | 240 |
| Number_of_Terminals | 484 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 8033 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA484,22X22,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.2500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
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