10AS027H3F35I1SP
Field Programmable Gate Array, 270000-Cell, PBGA1152Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel 10AS027H3F35I1SP is a Field Programmable Gate Array (FPGA) from the 10AS027 series. This device features 270,000 logic cells and 10,162 CLBs, organized to provide extensive logic capacity. It is housed in a 1152-terminal PBGA package (S-PBGA-B1152), with a terminal pitch of 1.00 mm and a package body measuring 35x35 mm. The operating temperature range is -40°C to +100°C. This component supports a nominal supply voltage of 0.9V, with a minimum of 0.87V and a maximum of 0.93V, and also operates at 0.95VCC nominal. Its surface-mount design and BGA package style are suitable for high-density applications. The Intel 10AS027H3F35I1SP is utilized in industries such as communications, data center, and industrial automation.
Additional Information
Series: 10AS027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | TSMC |
| Additional_Feature | ALSO OPERATES AT 0.95 VCC NOMINAL |
| JESD_30_Code | S-PBGA-B1152 |
| Number_of_CLBs | 10162 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 270000 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1152 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 10162 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA1152,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.3500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | .9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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