10AS022E4F27E3SP
Field Programmable Gate Array, 220000-Cell, PBGA672Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel's 10AS022E4F27E3SP is a high-performance Field Programmable Gate Array (FPGA) belonging to the 10AS022 series. This device offers 220,000 logic cells and an organization of 8033 CLBs, providing substantial computational power for complex digital designs. It features 240 configurable input and output lines within a 672-terminal Ball Grid Array (BGA) package, specifically an S-PBGA-B672 with a 1.00 mm terminal pitch. Operating within a temperature range of 0°C to 100°C, this FPGA supports a nominal supply voltage of 0.9V, with a range of 0.87V to 0.93V. Its TSMC technology and plastic/epoxy package construction are suitable for demanding applications across various industries, including telecommunications, industrial automation, and high-performance computing. The device's square package measures 27.00mm by 27.00mm with a maximum seated height of 3.35mm.
Additional Information
Series: 10AS022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 27.0000 |
| Technology | TSMC |
| Length | 27.0000 |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Inputs | 240 |
| Number_of_Logic_Cells | 220000 |
| Number_of_Outputs | 240 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 8033 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA672,26X26,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 3.3500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | .9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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