CYW15G0403DXB-BGI
IC TELECOM INTERFACE 256BGAManufacturer: Infineon Technologies
Categories: Telecom
Quality Control: Learn More
Infineon Technologies HOTlink II™ CYW15G0403DXB-BGI is a high-performance telecom interface component. This device, housed in a 256-L2BGA (27x27) package, is designed for demanding telecommunications applications. It features a 3.135V to 3.465V supply voltage range, ensuring compatibility with standard telecom power rails. The CYW15G0403DXB-BGI is optimized for surface mounting, facilitating integration into compact board designs. Its robust construction and precise interface capabilities make it suitable for use in networking infrastructure, data communication systems, and other advanced telecommunications equipment. This component is supplied in tray packaging for efficient handling and deployment.
Additional Information
Series: HOTlink II™RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 256-BGA Exposed Pad |
| Mounting Type | Surface Mount |
| Function | - |
| Interface | - |
| Operating Temperature | - |
| Voltage - Supply | 3.135V ~ 3.465V |
| Current - Supply | - |
| Supplier Device Package | 256-L2BGA (27x27) |
| Number of Circuits | 4 |