BGF148E6327XTSA1
IC INTERFACE PROTECTION TSNP14-2Manufacturer: Infineon Technologies
Categories: Specialized ICs
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Infineon Technologies BGF148E6327XTSA1 is a high-performance interface protection device designed for demanding applications. This TSNP-14-2 package component provides robust electrostatic discharge (ESD) protection, crucial for safeguarding sensitive circuitry in systems like HSMMC interfaces. Its integrated EMI filtering capabilities further enhance signal integrity by attenuating unwanted electromagnetic interference. The PG-TSNP-14-2 package, featuring an exposed pad, facilitates efficient heat dissipation and reliable surface mounting, making it suitable for high-density board designs. This component finds application in various industries requiring rigorous protection and signal conditioning, including consumer electronics and telecommunications.
Additional Information
Series: -RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 14-XFQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Type | Interface Protection |
| Applications | HSMMC ESD Protection, EMI Filter |
| Supplier Device Package | PG-TSNP-14-2 |
| Programmable | Not Verified |
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