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SIGC25T60UNX1SA1

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SIGC25T60UNX1SA1

IGBT 3 CHIP 600V WAFER

Manufacturer: Infineon Technologies

Categories: Single IGBTs

Quality Control: Learn More

Infineon Technologies SIGC25T60UNX1SA1 is an NPT IGBT die designed for high-performance applications. This component features a 600V collector-emitter breakdown voltage and a continuous collector current rating of 30A, with a pulsed current capability of 90A. The on-state voltage (Vce(on)) is a maximum of 3.15V at 15V gate voltage and 30A collector current. Switching characteristics include turn-on delay (td(on)) of 16ns and turn-off delay (td(off)) of 122ns at 25°C, tested under 400V, 30A, 1.8 Ohm, and 15V conditions. Operating temperature ranges from -55°C to 150°C (TJ). The SIGC25T60UNX1SA1 is provided as a bare die for surface mount integration, suitable for power factor correction, uninterruptible power supplies (UPS), and industrial motor control applications.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Bulk
Technical Details:
PackagingBulk
Package / CaseDie
Mounting TypeSurface Mount
Operating Temperature-55°C ~ 150°C (TJ)
Input TypeStandard
Vce(on) (Max) @ Vge, Ic3.15V @ 15V, 30A
Supplier Device PackageDie
IGBT TypeNPT
Td (on/off) @ 25°C16ns/122ns
Switching Energy-
Test Condition400V, 30A, 1.8Ohm, 15V
Current - Collector (Ic) (Max)30 A
Voltage - Collector Emitter Breakdown (Max)600 V
Current - Collector Pulsed (Icm)90 A

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