BGM781N11E6327XUSA1
MODULE GPS FRONT-END TSNP-11-2Manufacturer: Infineon Technologies
Categories: RF Front End (LNA + PA)
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Infineon Technologies BGM781N11E6327XUSA1 is a GPS RF front-end module designed for high-performance positioning applications. This electronic component integrates a low-noise amplifier (LNA) and power amplifier (PA) optimized for the GPS L1 band at 1575.42MHz. The module utilizes the PG-TSNP-11 package, a 10-lead wafer-level flip-chip die package with an exposed pad for enhanced thermal management and signal integrity. Packaged on tape and reel, the BGM781N11E6327XUSA1 is suitable for high-volume automated assembly processes. Its robust design and integrated functionality make it a key component in automotive navigation systems, portable consumer electronics, and various telematics solutions requiring reliable GNSS reception.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Features | - |
| Packaging | Tape & Reel (TR) |
| Package / Case | 10-WFDFN Exposed Pad |
| Frequency | 1575.42MHz |
| RF Type | GPS |
| Supplier Device Package | PG-TSNP-11 |
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