CYT4DNJBPCQ1BZSGS
TRAVEO-2 CLUST.2.5DGRAPHManufacturer: Infineon Technologies
Categories: Microcontrollers
Quality Control: Learn More
Infineon Technologies CYT4DNJBPCQ1BZSGS Traveo™ T2G microcontroller, featuring a 32-Bit Tri-Core architecture with ARM® Cortex®-M0+ and ARM® Cortex®-M7F cores operating at 100MHz and 320MHz respectively. This device offers 6.19MB of FLASH program memory and 640KB of RAM, complemented by 128KB of EEPROM. Connectivity options include CANbus, Ethernet, I2C, LINbus, SPI, and UART/USART. Peripherals include DMA, I2S, LVD, a temperature sensor, and a WDT. The 327-FBGA (17x17) package is designed for surface mounting and operates within a temperature range of -40°C to 105°C. This component is well-suited for automotive applications, specifically in instrument clusters and body electronics.
Additional Information
Series: Traveo™ T2GRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 327-LFBGA |
| Mounting Type | Surface Mount |
| Speed | 100MHz, 320MHz |
| Program Memory Size | 6.19MB (6.19M x 8) |
| RAM Size | 640K x 8 |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Oscillator Type | External, Internal |
| Program Memory Type | FLASH |
| EEPROM Size | 128K x 8 |
| Core Processor | ARM® Cortex®-M0+, ARM® Cortex®-M7F |
| Data Converters | A/D 48x12b SAR |
| Core Size | 32-Bit Tri-Core |
| Voltage - Supply (Vcc/Vdd) | 2.7V ~ 5.5V |
| Connectivity | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART |
| Peripherals | DMA, I2S, LVD, Temp Sensor, WDT |
| Supplier Device Package | 327-FBGA (17x17) |
| Grade | - |
| Number of I/O | 168 |
| Qualification | - |
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