Infineon Technologies CY7C1414BV18-200BZC is a 36Mbit parallel SRAM device. This component features a 165-pin FBGA package, offering high-density memory solutions for demanding applications. Operating at 200 MHz, it provides efficient data access for high-performance systems. Its parallel interface ensures rapid data transfer, making it suitable for applications requiring low latency and high throughput. This memory component is commonly integrated into networking infrastructure, telecommunications equipment, and high-end computing platforms. The CY7C1414BV18-200BZC is supplied in tray packaging.
Additional Information
Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray