P3000ZL45X168HPSA1
PRESS PACK IGBTManufacturer: Infineon Technologies
Categories: IGBT Modules
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The Infineon Technologies P3000ZL45X168HPSA1 is a single-configuration Press Pack IGBT module. This component features a Trench IGBT type, designed for high-power applications with a maximum collector-emitter voltage of 4500 V and a continuous collector current of 3000 A. The on-state voltage drop at the maximum current is specified as 2.5 V at 15 V gate-emitter voltage.
With an input capacitance (Cies) of 620 nF at 25 V, this module is suitable for demanding switching applications. It is housed in a TO-200AF package, identified by the Supplier Device Package BG-P16826K-1, and utilizes a Chassis Mount for robust thermal management. The operating temperature range is -40°C to 150°C (TJ). This component finds application in power conversion systems, industrial motor drives, and electric traction.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | TO-200AF |
| Mounting Type | Chassis Mount |
| Input | Standard |
| Configuration | Single |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Vce(on) (Max) @ Vge, Ic | 2.5V @ 15V, 3000A |
| NTC Thermistor | No |
| Supplier Device Package | BG-P16826K-1 |
| IGBT Type | Trench |
| Current - Collector (Ic) (Max) | 3000 A |
| Voltage - Collector Emitter Breakdown (Max) | 4500 V |
| Current - Collector Cutoff (Max) | 200 µA |
| Input Capacitance (Cies) @ Vce | 620 nF @ 25 V |
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