IBM 3229L7640. This electronic component, a CISCPIN 1.2 CM6S2 5LM, features a 32x42 CCGA package. Designed for demanding memory applications, it is suitable for high-performance computing, data storage, and advanced telecommunications infrastructure. The component's robust design and MCM (Multi-Chip Module) construction ensure reliability and advanced functionality for complex system designs. Its tray packaging facilitates efficient handling and integration into high-volume manufacturing processes.
Additional Information
Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray