IBM 2547P1088 is a memory component designed for high-performance applications. This part, identified by the 2547P1088 designation, features a 456EPBGA package with a 1.27mm pitch, offering a compact footprint for dense board layouts. The ODYSSEY series designation indicates its advanced capabilities within IBM's product portfolio. This component is fabricated using cutting-edge technology suitable for demanding electronic systems. Its robust packaging ensures reliability in harsh environments. This memory solution is commonly employed in sectors such as telecommunications, computing, and advanced industrial automation where consistent data integrity and speed are paramount. The component is supplied in tray packaging for efficient handling and integration into manufacturing processes.
Additional Information
Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray