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EPC2012

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EPC2012

GANFET N-CH 200V 3A DIE

Manufacturer: EPC

Categories: Single FETs, MOSFETs

Quality Control: Learn More

EPC's eGaN® series EPC2012 is an N-Channel GaNFET designed for high-performance power conversion applications. This surface mount die offers a 200 V breakdown voltage and a continuous drain current capability of 3 A at 25°C. Featuring a low on-resistance of 100 mOhm at 3 A and 5 Vgs, this device minimizes conduction losses. The EPC2012 boasts a gate charge (Qg) of 1.8 nC (max) and input capacitance (Ciss) of 145 pF (max) at 100 Vds, facilitating efficient switching. It operates across a temperature range of -40°C to 125°C (TJ) and is supplied in Tape & Reel packaging. This component is suitable for use in power supply units, DC-DC converters, and motor drive systems.

Additional Information

Series: eGaN®RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: DiscontinuedPackaging: Tape & Reel (TR)Datasheet:
Technical Details:
PackagingTape & Reel (TR)
Package / CaseDie
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 125°C (TJ)
TechnologyGaNFET (Gallium Nitride)
FET TypeN-Channel
Current - Continuous Drain (Id) @ 25°C3A (Ta)
Rds On (Max) @ Id, Vgs100mOhm @ 3A, 5V
FET Feature-
Power Dissipation (Max)-
Vgs(th) (Max) @ Id2.5V @ 1mA
Supplier Device PackageDie
Drive Voltage (Max Rds On, Min Rds On)5V
Vgs (Max)+6V, -5V
Drain to Source Voltage (Vdss)200 V
Gate Charge (Qg) (Max) @ Vgs1.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds145 pF @ 100 V

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