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PI90LVB022LE

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PI90LVB022LE

IC MULTIPLEXER LVDS 1CH 16TSSOP

Manufacturer: Diodes Incorporated

Categories: Signal Buffers, Repeaters, Splitters

Quality Control: Learn More

The Diodes Incorporated PI90LVB022LE is a 1x2:2 channel LVDS buffer/multiplexer designed for high-speed signal routing. Operating with a supply voltage range of 3V to 3.6V and consuming 21mA, this component supports data rates up to 650Mbps. It features LVDS inputs and outputs, with an input capacitance of 8 pF and a typical delay time of 4.0ns. The PI90LVB022LE is housed in a 16-TSSOP package for surface mounting. This device finds application in systems requiring efficient LVDS signal distribution and selection, including telecommunications infrastructure and high-performance computing.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tube
Technical Details:
PackagingTube
Package / Case16-TSSOP (0.173"", 4.40mm Width)
Delay Time4.0ns
Number of Channels1 x 2:2
Mounting TypeSurface Mount
OutputLVDS
TypeBuffer, Multiplexer
InputLVDS
Operating Temperature-40°C ~ 85°C
Voltage - Supply3V ~ 3.6V
ApplicationsLVDS
Current - Supply21mA
Data Rate (Max)650Mbps
Supplier Device Package16-TSSOP
Signal Conditioning-
Capacitance - Input8 pF

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.