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20-101-1138

IC MOD RABBIT4000 58.98MHZ 1.5MB

Manufacturer: Digi

Categories: Microcontrollers, Microprocessor, FPGA Modules

Quality Control: Learn More

Digi RabbitCore RCM4300 series module featuring the Rabbit 4000 core processor. This MPU module operates at 58.98MHz and provides 1.5MB of RAM. It includes 2MB of internal flash memory with an external microSD card slot for expandable storage. Connectivity is facilitated via a 2x25 IDC header, a 2x5 header, and a microSD card connector. The Digi RCM4300 is suitable for applications in industrial automation, building controls, and data acquisition systems. Operating temperature range is -20°C to 85°C. The module dimensions are 1.840" L x 2.850" W (47.00mm x 72.00mm).

Additional Information

Series: RabbitCore RCM4300RoHS Status: RoHS CompliantManufacturer Lead Time: 26 week(s)Product Status: Not For New DesignsPackaging: BulkDatasheet:
Technical Details:
PackagingBulk
Connector TypeIDC Header 2x25, 2x5, 1xmicroSD Card
Size / Dimension1.840"" L x 2.850"" W (47.00mm x 72.00mm)
Speed58.98MHz
RAM Size1.5MB
Operating Temperature-20°C ~ 85°C
Module/Board TypeMPU Core
Core ProcessorRabbit 4000
Co-Processor-
Flash Size2MB (Internal), microSD Slot (External)

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.