BCM63156B1UKFSBG
SINGLE 35, BONDED 17 GW,NO VOIP/Manufacturer: Broadcom Limited
Categories: Telecom
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Broadcom Limited BCM63156B1UKFSBG is a Telecom IC designed for advanced networking applications. This single-chip solution integrates 35 bonded 17 GW capabilities, specifically excluding VoIP functionality for specialized telecommunications infrastructure. Its robust architecture is optimized for high-performance data processing and switching within demanding network environments. The BCM63156B1UKFSBG is typically supplied in Tray packaging, ensuring efficient handling and integration into high-volume manufacturing processes. This component is a critical element in the development of next-generation telecommunications systems, supporting critical infrastructure deployments across various industries.
Additional Information
Series: -RoHS Status: unknownManufacturer Lead Time: 50 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |