XLP104B0IFSB00080G
FCBGA+HS 29X29 779Manufacturer: Broadcom Limited
Categories: Microprocessors
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Broadcom Limited XLP104B0IFSB00080G is a microprocessor integrated circuit. This component, utilizing a Flip Chip Ball Grid Array (FCBGA) package measuring 29x29mm, features 779 balls. Its primary function as a microprocessor makes it a critical element in various advanced computing and communication systems. Applications for this device are found across telecommunications infrastructure, enterprise networking, and high-performance computing segments where robust processing capabilities are paramount. The XLP104B0IFSB00080G is supplied in Tray packaging, suitable for high-volume manufacturing environments.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
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