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100-1500-1

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100-1500-1

IC MODULE I.MX537 800MHZ 1GB

Manufacturer: BECOM Systems GmbH

Categories: Microcontrollers, Microprocessor, FPGA Modules

Quality Control: Learn More

The BECOM Systems GmbH i.MX module, part number 100-1500-1, is an embedded unit featuring the i.MX537 core processor operating at 800MHz. This MPU Core module provides 1Gb of RAM and incorporates 2GB of NAND flash along with 4MB of NOR flash for robust storage capabilities. Designed for demanding applications, it utilizes a Qseven Card-Edge 230 connector and measures 70.00mm x 70.00mm. Operating across an industrial temperature range of -40°C to 85°C, this component is suitable for industries such as industrial automation, medical devices, and digital signage.

Additional Information

Series: i.MXRoHS Status: RoHS CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:
Technical Details:
PackagingBulk
Connector TypeQseven Card-Edge 230
Size / Dimension2.760"" L x 2.760"" W (70.00mm x 70.00mm)
Speed800MHz
RAM Size1Gb
Operating Temperature-40°C ~ 85°C
Module/Board TypeMPU Core
Core Processori.MX537
Co-Processor-
Flash Size2GB (NAND), 4MB (NOR)

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.