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CENGPXA270-312-10-550EC

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CENGPXA270-312-10-550EC

IC MOD PXA270 312MHZ 64MB

Manufacturer: Beacon EmbeddedWorks

Categories: Microcontrollers, Microprocessor, FPGA Modules

Quality Control: Learn More

Beacon EmbeddedWorks CENGPXA270-312-10-550EC is an embedded module featuring the PXA270 processor operating at 312MHz. This module integrates 64MB of RAM and 64MB of flash memory, providing a compact solution for embedded system designs. The SO-DIMM-144 connector ensures a standardized interface. This component is well-suited for applications in industrial automation, medical devices, and communication infrastructure, where reliable processing and ample memory are critical. Its specifications support demanding operational requirements within a 0°C to 70°C temperature range. The module's dimensions are 2.370" L x 2.670" W (60.20mm x 67.80mm).

Additional Information

Series: -RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging:
Technical Details:
Packaging
Connector TypeSO-DIMM-144
Size / Dimension2.370"" L x 2.670"" W (60.20mm x 67.80mm)
Speed312MHz
RAM Size64MB
Operating Temperature0°C ~ 70°C
Module/Board TypeMCU Core
Core ProcessorPXA270
Co-Processor-
Flash Size64MB

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.