AF032GEC5X-2001EX
IC FLASH 256GBIT EMMC 153BGAManufacturer: ATP Electronics, Inc.
Categories: Memory
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ATP Electronics, Inc. presents the AF032GEC5X-2001EX, a 256Gbit eMMC embedded flash memory component from their Ex-Temp series. This NAND flash memory utilizes Multi-Level Cell (MLC) technology and is organized as 32 Gigabits x 8. The device is housed in a compact 153-ball FBGA package with dimensions of 11.5x13mm, designed for surface mount applications. Engineered for demanding environments, it operates across an extended temperature range of -40°C to 105°C. This component is suitable for industrial, automotive, and networking applications requiring robust and high-capacity non-volatile storage.
Additional Information
Series: Ex-TempRoHS Status: ROHS3 CompliantManufacturer Lead Time: 10 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 153-FBGA |
| Mounting Type | Surface Mount |
| Memory Size | 256Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | -40°C ~ 105°C |
| Technology | FLASH - NAND (MLC) |
| Memory Format | FLASH |
| Supplier Device Package | 153-BGA (11.5x13) |
| Memory Interface | eMMC |
| Memory Organization | 32G x 8 |
| Programmable | Not Verified |
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