ADSP-SC573-BCZENG
Digital Signal Processor, CMOS, PBGA400Manufacturer: Analog Devices Inc.
Categories: Digital Signal Processors
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Analog Devices Inc. ADSP-SC573-BCZENG is a CMOS Digital Signal Processor housed in a 400-ball PBGA package (S-PBGA-B400). This LFBGA component features a square package style with a low profile and fine pitch, measuring 17x17mm with a terminal pitch of 0.8mm. Operating within a temperature range of 0°C to 70°C, it supports a supply voltage from 3.13V to 3.47V, with a nominal 3.30V. Designed for surface mounting with ball terminals on the bottom, this device is utilized in applications requiring high-performance signal processing, including industrial automation, audio processing, and automotive systems.
Additional Information
Series: ADSPSC573RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 17.0000 |
| Width | 17.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B400 |
| Number_of_Terminals | 400 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.5000 |
| Supply_Voltage_Max | 3.4700 |
| Supply_Voltage_Min | 3.1300 |
| Supply_Voltage_Nom | 3.3000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | DIGITAL SIGNAL PROCESSOR, OTHER |
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