DS34S132GNA2+
IC TELECOM INTERFACE 676TEPBGAManufacturer: Analog Devices Inc./Maxim Integrated
Categories: Telecom
Quality Control: Learn More
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 676-BGA |
| Mounting Type | Surface Mount |
| Function | TDM-over-Packet (TDMoP) |
| Interface | TDMoP |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | 1.8V, 3.3V |
| Current - Supply | - |
| Supplier Device Package | 676-TEPBGA (27x27) |
| Number of Circuits | 1 |
Request a Quote
Clients Also Buy
DS21552LB
5V T1 SINGLE-CHIP TRANSCEIVER
DS21348GN
IC TELECOM INTERFACE 49CSBGA
DS21Q354BN
IC TELECOM INTERFACE 256BGA
