DS34S132GN
IC TELECOM INTERFACE 676TEPBGAManufacturer: Analog Devices Inc./Maxim Integrated
Categories: Telecom
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Analog Devices Inc./Maxim Integrated DS34S132GN is a highly integrated TDM-over-Packet (TDMoP) solution. This electronic component facilitates the transport of Time Division Multiplexed (TDM) traffic over packet-switched networks, a critical function in modern telecommunications infrastructure. Featuring a 676-TEPBGA (27x27) package, it is designed for robust surface mount applications. The DS34S132GN supports dual supply voltages of 1.8V and 3.3V, operating efficiently within a temperature range of -40°C to 85°C. Its application is prevalent in carrier-grade voice and data transmission systems, enabling seamless integration of legacy TDM equipment with IP-based networks.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 676-BGA |
| Mounting Type | Surface Mount |
| Function | TDM-over-Packet (TDMoP) |
| Interface | TDMoP |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | 1.8V, 3.3V |
| Current - Supply | - |
| Supplier Device Package | 676-TEPBGA (27x27) |
| Number of Circuits | 1 |
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