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MAX32680GLR+

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MAX32680GLR+

IC MCU CORTEX M4F HART & BLE

Manufacturer: Analog Devices Inc./Maxim Integrated

Categories: System On Chip (SoC)

Quality Control: Learn More

The Analog Devices Inc./Maxim Integrated MAX32680GLR- is an ARM® Cortex®-M4F System On Chip (SoC) operating at 100MHz. This device features 512KB of flash memory and 128KB of RAM, supported by a suite of peripherals including DMA, I2S, PWM, and WDT. Connectivity options are extensive, encompassing Bluetooth, I2C, SPI, and UART interfaces. The MAX32680GLR- is housed in an 88-LGA (10x10) package with an exposed pad, designed for operation within an ambient temperature range of -40°C to 85°C. This component is suitable for applications in industrial automation, medical devices, and consumer electronics requiring robust processing and wireless communication capabilities.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 21 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case88-VFLGA Exposed Pad
Speed100MHz
RAM Size128KB
Operating Temperature-40°C ~ 85°C (TA)
Core ProcessorARM® Cortex®-M4F
Primary Attributes-
ConnectivityBluetooth, I2C, SPI, UART
PeripheralsDMA, I2S, PWM, WDT
Supplier Device Package88-LGA (10x10)
ArchitectureMCU
Flash Size512KB

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SoC FAQs

A System-on-Chip (SoC) is an integrated circuit that combines processors, memory, communication interfaces, and peripherals onto a single chip to reduce power consumption and improve efficiency.

A SoC works by integrating multiple computing functions into one semiconductor device, enabling processors, memory, graphics, and connectivity modules to communicate efficiently within a compact architecture.

SoCs are used in:

  • Smartphones
  • IoT devices
  • Wearable technology
  • Automotive electronics
  • Embedded systems
  • Edge computing
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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.