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MAX7314ATG+TG05

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MAX7314ATG+TG05

INTEGRATED CIRCUIT

Manufacturer: Analog Devices Inc./Maxim Integrated

Categories: I/O Expanders

Quality Control: Learn More

Analog Devices Inc./Maxim Integrated MAX7314ATG-TG05 is a highly integrated I/O expander designed for efficient peripheral control. This component offers a flexible solution for increasing available input/output pins in embedded systems. It is manufactured by Analog Devices Inc./Maxim Integrated and is part of their I/O Expander product family. The MAX7314ATG-TG05 is supplied in a Tape & Reel (TR) package, facilitating automated assembly processes. This versatile I/O expander finds application in various industrial automation, consumer electronics, and communication systems where maximizing port density is critical. Its robust design and reliable performance make it a suitable choice for demanding applications requiring precise control of external signals.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)
Technical Details:
PackagingTape & Reel (TR)
ProgrammableNot Verified

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

Frequently Asked Questions

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.