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DS1216F

IC SMART/ROM 3V 64/256/1M 32DIP

Manufacturer: Analog Devices Inc./Maxim Integrated

Categories: Controllers

Quality Control: Learn More

The Analog Devices Inc./Maxim Integrated DS1216F is a 32-pin DIP (Dual In-line Package) socket component designed for advanced control applications. This electronic component, identified by part number DS1216F, functions as a Smart/ROM device with a voltage supply range of 4.5V to 5.5V. It offers flexible memory configurations, supporting densities of 64/256/1M bits. The through-hole mounting type and the 0°C to 70°C operating temperature range make it suitable for various industrial and commercial environments. This component finds utility in systems requiring intelligent memory management and control, often seen in applications such as data logging and embedded control systems. The 32-DIP socket package ensures robust connectivity.

Additional Information

Series: -RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:
Technical Details:
PackagingTube
Package / Case32-DIP (0.600"", 15.24mm) Socket
Mounting TypeThrough Hole
Operating Temperature0°C ~ 70°C
Voltage - Supply4.5V ~ 5.5V
Controller TypeSmartwatch ROM
Supplier Device Package32-DIP Socket

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.