10120132-P0E-20DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® 10120132-P0E-20DLF is a high-density, right-angle header designed for demanding backplane applications. This component features male pins and blades with a black housing and a robust through-hole mounting style. The XCede® series connector is engineered for superior signal integrity and mechanical performance. It offers a substantial contact layout with 48 signal pairs and 52 ground contacts, ensuring high bandwidth and reliable connectivity. The GXT™ contact finish provides exceptional durability and low insertion force, with a contact finish thickness of 30.0µin (0.76µm). This header is suitable for high-performance computing, telecommunications infrastructure, and enterprise networking equipment. The connector includes keying features for proper mating and is supplied in bulk packaging. Termination is achieved via press-fit technology.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120132-P0E-20DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | Key |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Guide Right |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 48 Signal Pairs, 52 Ground |
| Number of Columns | 8 |
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