10120128-M0C-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) presents the XCede® series connector header, part number 10120128-M0C-30DLF. This right-angle header features male pins and blades for robust PCB interconnection. Designed for demanding applications, it utilizes a through-hole mounting type and a press-fit termination for secure mechanical and electrical engagement. The connector supports a 6-column configuration, facilitating high-density backplane connectivity. The contact finish is a high-performance gold or GXT™ plating with a thickness of 30.0µin (0.76µm), ensuring excellent conductivity and long-term reliability. This component is integral to high-speed signaling in networking, telecommunications, and data center infrastructure. Supplied in bulk packaging, this black header exemplifies Amphenol ICC's commitment to advanced interconnect solutions.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:&mpn=10120128-M0C-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | - |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Right Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | - |
| Number of Columns | 6 |
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