10120126-Y0J-20DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® 10120126-Y0J-20DLF is a high-density connector header designed for demanding backplane applications. This through-hole mounted component features male pins and blades with a black housing, incorporating a Guide Right connector style for robust mating. The contact finish is Gold or Gold, GXT™ with a thickness of 30.0µin (0.76µm), ensuring excellent conductivity and durability. With a typical contact layout of 16 signal pairs and 18 grounds across four columns, this header is engineered for high-performance data transmission. The bulk packaging is suitable for high-volume manufacturing. This component finds application in networking, telecommunications, and high-performance computing systems requiring reliable, high-speed interconnectivity. The termination method is press-fit.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120126-Y0J-20DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Guide Right |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 16 Signal Pairs, 18 Ground |
| Number of Columns | 4 |
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